TRF3705
www.ti.com
SLWS223A – AUGUST 2011 – REVISED OCTOBER 2011
APPLICATION INFORMATION
Application Schematic
Figure 65 shows a typical TRF3705 application schematic.
BBI
49.9 W
49.9 W
PD
1
18
VCC
LO
Input
GND
LOP
2
3
Thermal Pad
17
16
GND
RF OUT
6.8 pF
RF
Output
LOM
4
15
GND
0.2 pF
49.9 W
GND
GC
5
6
14
13
GND
GND
49.9 W
49.9 W
BBQ
Figure 65. Typical Application Circuit
Power Supply and Grounding
The TRF3705 is powered by supplying a nominal 3.3 V to pins 18 and 24. These supplies can be tied together
and sourced from a single clean supply. Proper RF bypassing should be placed close to each power supply pin.
Ground pin connections should have at least one ground via close to each ground pin to minimize ground
inductance. The PowerPAD ? must be tied to ground, preferably with the recommended ground via pattern to
provide a good thermal conduction path to the alternate side of the board and to provide a good RF ground for
the device. (Refer to PCB Design Guidelines for additional information.)
Baseband Inputs
The baseband inputs consist of the in-phase signal (I) and the Quadrature-phase signal (Q). The I and Q lines
are differential lines that are driven in quadrature. The nominal drive level is 1-V PP differential on each branch.
The baseband lines are nominally biased at 0.25-V common-mode voltage (V CM ); however, the device can
operate with a V CM in the range of 0 V to 0.5 V. The baseband input lines are normally terminated in 50 Ω ,
though it is possible to modify this value if necessary to match to an external filter load impedance requirement.
Copyright ? 2011, Texas Instruments Incorporated
Product Folder Link(s): TRF3705
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